藤井 宏樹, 長井 悠宰, 生津 資大, 荒木 望, 井上 尚三, 冨澤 泰
年次大会講演論文集 2008 171-172 2008年
This paper describes novel biaxial tensile test technique for a film specimen to investigate material responses to uniaxial and biaxial tensile forces. We have developed biaxial tensile tester that consists of four sets of actuator, loadcell, and displacement meter in order to apply an arbitrary amount of tensile force to a film specimen in each axis. With the uniaxial test specimen of sputtered Al-Si-Cu film at room temperature (RT), average Young's modulus of 66.4 GPa and yield stress of 139.1 MPa have been obtained. With the biaxial test specimen, the yield locus has been evaluated by applying biaxial stresses with various strain rate ratios. The obtained yield stresses could be fitted by the yield criterion based on Hill equation, indicating that the flow stress under biaxial stress condition differ from that under uniaxial condition. Information about the yield locus would be useful for the structural design of MEMS including Al-Si-Cu film structures subjected to biaxial stresses.