松本 歩

Metal-assisted etching (metal-assisted chemical etching) is an efficient method to fabricate porous silicon (Si). When using platinum (Pt) particles as metal catalysts in metal-assisted etching, a composite porous structure of straight macropores formed beneath the Pt particles and a mesoporous layer formed on the entire surface of Si can be fabricated. The formation mechanism of the composite structure is still open to discussion. We previously demonstrated that the ratio of mesoporous layer thickness to macropore depth showed a large value (approximately 1.1) in the case of highly-doped p-Si. In this study, we investigated the composite structure formation by using p-Si substrates with different doping densities and etching solutions with different concentrations of hydrogen peroxide (H₂O₂). There was not significant difference in the structures formed on low- and moderately-doped Si, despite the large difference in doping density. The ratio of mesoporous layer thickness to macropore depth increased within the range approximately from 0.1 to 0.4 with increasing the H₂O₂ concentration in the case of low- and moderately-doped Si, but it did not change in the case of highly-doped Si. We discussed the observation results based on the spatial distribution of hole consumption and the band structures at Pt/Si and Si/electrolyte interfaces.

Strong correlations were found between underwater LIBS signals and bubble collapse time. Signal fluctuation caused by the repeated irradiation at a fixed position was successfully reduced by the normalization with bubble collapse time.

Platinum (Pt) is one of the interesting catalysts in metal-assisted etching (metal-assisted chemical etching) of silicon (Si). The Pt-assisted etching induces not only the dissolution of Si under the Pt catalysts but also the formation of mesoporous layer on the Si surface away from them. In this work, we etched n-Si and p-Si by using patterned Pt films with a diameter of 5 μm and an interval of 50 μm. For both the cases, the Si surface under the Pt catalysts was selectively etched and macropores with a diameter of 5 μm were formed. The macropores formed on n-Si were deeper than those formed on p-Si. The mesoporous layer was observed only around the macropores on n-Si, while it was observed over the entire surface of p-Si. We also measured the open circuit potential of Si in the etching solution. The positive shift of potential of n-Si by the Pt deposition was smaller than that of p-Si except for the initial stage of etching, which can be explained by the polarization characteristics. We discussed the etching behavior of n-Si and p-Si on the basis of the results of structure observation and electrochemical measurements.