NAMAZU Takahiro, ITO Shun, KUROISHI Junki, INOUE Shozo, MORINO Katsuya, MIYAKE Shugo
Mechanical Engineering Congress, Japan, 2014 "J2240203-1"-"J2240203-4", Sep 7, 2014
Sputtered Al/Ni multilayer films show self-propagating exothermic reaction, which can be provided by just applying very small energy into the films. The reaction performances are known to depend on the light-metal and transition-metals combination, the bilayer thickness, and the entire film thickness. For example, the film with 100-nm-bilayer thickness and 30-μm-entire-film thickness can provide the heat energy of 1300 J/g, which corresponds to approximately 500℃. The authors are developing room temperature solder bonding technique using the reactive films for MEMS hermetic packages. During the reaction, cracking occurs due to volume shrinkage. Cracks in the bonded portion definitely lead to fatal errors and problems in the light of the seal performance and mechanical reliability. In this presentation, cracking and deformation phenomena are evaluated by means of X-ray transmission observation and energy dispersive X-ray analysis. Long-term sealing performance is also reported.