Hidenobu Mori

Microscopic characterization of generation lifetimes in a SiO 2 /Si structure has been carried out using scanning capacitance microscopy (SCM). Generation lifetimes could be investigated by monitoring the capacitance transient due to inversion layer formation. The validity of local capacitance transient measurements by SCM was verified by comparing with the results of conventional capacitance transient measurements using a MOS capacitor. Furthermore, it was demonstrated that SCM can be used for imaging of the formation process of the inversion layer on a nanometer scale.

Contactless capacitance transient techniques have been applied to local mapping of interface traps of a semiconductor wafer. In contactless capacitance transient techniques, a Metal-Air gap-Oxide-Semiconductor (MAOS) structure is used instead of a conventional Metal-Oxide-Semiconductor (MOS) structure. The local mapping of interface traps was obtained by using a contactless Isothermal Capacitance Transient Spectroscopy (ICTS), which is one of the contactless capacitance transient techniques. The validity of the contactless ICTS was demonstrated by characterizing a partially Au-doped Si wafer. The results revealed that local mapping of interface traps using contactless capacitance transient techniques is effective in wafer inspection and is a promising technique for the development of MOS devices and solar cells with high reliability and high performance. (C) 2016 Author(s).

In recent years, special interests have been paid to the advantage of using III-V compound semiconductors for the microelectronic and optoelectronic industries because of its high-speed response. Ion beam induced charge (IBIC) and transient-IBIC techniques are useful in order to investigate the single event effects, which is one of the most serious problems to use semiconductor devices in space. During image collection, the ion-induced damage is introduced. Therefore the degradation behavior of collected charge and transient current are important issue to use these techniques most effectively. To estimate degradation behavior, the damage factors of InGaAs devices are compared with that of Si devices by using the concept of non-ionizing energy loss. © 2003 Elsevier B.V. All rights reserved.